The Economic Times

Paras Defence arm to set up 6,200 crore semiconductor packaging facility in Madhya Pradesh

Paras Semiconductors is set to invest 6,200 crore in the construction of a cutting-edge semiconductor packaging facility in Madhya Pradesh. This initiative follows the signing of a significant memorandum of understanding and aims to elevate India's semiconductor industry through advanced outsourced assembly and testing operations, catering to evolving technological demands.