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The Economic Times

Economy / The Economic Times

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Intel, 3DGS sign $3.3-billion Odisha semiconductor MoU

A significant investment of $3.3 billion is set to boost India's semiconductor ecosystem. Intel, Odisha government, and 3D Glass Solutions have signed a memorandum of understanding. This collaboration will establish a new facility in Bhubaneswar-Khurda, focusing on advanced packaging and glass core substrates.

29 May 2026 11:54 pm