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Hyderabad News

Phys.org

Hyderabad / Phys.org

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A novel chip-on-wafer platform for next-generation AI hardware

A new semiconductor integration platform developed at the Institute of Science Tokyo combines advanced chip packaging with high-density interconnects and improved thermal management. This combination of three complementary technologies helps overcome the key challenges in building high-performance artificial intelligence (AI) hardware.

12 Aug 2026 9:50 pm